Roles of Mo and Cu on Electrochemical Behaviors of Ni-Base Alloys in Hydrofluoric Acid Solution. Issue 10 (10th June 2020)

• Record Type: Journal Article
• Authors: Yang, Biaobiao; Hou, Yuhang; Li, Yunping; Chiba, Akihiko
• Is Part Of: Journal of the Electrochemical Society. Volume 167:Issue 10(2020)
• Publication Date: 2020-06-10
• Subjects: Ni-base alloy -- Cu -- Hydrofluoric acid solutions -- Electrochemical analysis; Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/1945-7111/ab98ab
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : Electrochemical measurements were performed on Ni-30Co-16Cr-xMo and Ni-30Co-16Cr-xMo-2Cu (x = 7–15, wt%) alloys to clarify their electrochemical responses and corrosion behaviors influenced by Mo and Cu in 0.5 M aqueous HF acid solution at room temperature. Results indicate that both Mo and Cu play positive roles in improving the corrosion resistance. The enhanced corrosion performance by Cu addition is observed in all alloys while this is more obvious in the alloy with low Mo concentration. Moreover, 2 wt% Cu addition is found to not only reduce the critical Mo concentration for spontaneous passivation of alloy, but also alter the nature of the exposed surface with distinct declines of effective capacitance. Ni-30Co-16Cr-15Mo-2Cu alloy shows the best corrosion resistance among all alloys studied.