Toward Controlling Filament Size and Location for Resistive Switches via Nanoparticle Exsolution at Oxide Interfaces. Issue 41 (17th September 2020)

• Record Type: Journal Article
• Authors: Spring, Jonathan; Sediva, Eva; Hood, Zachary D.; Gonzalez‐Rosillo, Juan Carlos; O'Leary, Willis; Kim, Kun Joong; Carrillo, Alfonso J.; Rupp, Jennifer L. M.
• Is Part Of: Small. Volume 16:Issue 41(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-09-17
• Subjects: exsolution -- filament confinement -- memristors -- resistive switching -- strontium titanate; Nanotechnology -- Periodicals; Nanoparticles -- Periodicals; Microtechnology -- Periodicals; 620.5
• DOI: 10.1002/smll.202003224
• Languages: English
• ISSNs: 1613-6810

Abstract

Abstract: Memristive devices are among the most prominent candidates for future computer memory storage and neuromorphic computing. Though promising, the major hurdle for their industrial fabrication is their device‐to‐device and cycle‐to‐cycle variability. These occur due to the random nature of nanoionic conductive filaments, whose rupture and formation govern device operation. Changes in filament location, shape, and chemical composition cause cycle‐to‐cycle variability. This challenge is tackled by spatially confining conductive filaments with Ni nanoparticles. Ni nanoparticles are integrated on the bottom La0.2 Sr0.7 Ti0.9 Ni0.1 O3− δ electrode by an exsolution method, in which, at high temperatures under reducing conditions, Ni cations migrate to the perovskite surface, generating metallic nanoparticles. This fabrication method offers fine control over particle size and density and ensures strong particle anchorage in the bottom electrode, preventing movement and agglomeration. In devices based on amorphous SrTiO3, it is demonstrated that as the exsolved Ni nanoparticle diameter increases up to ≈ 50 nm, the ratio between the ON and OFF resistance states increases from single units to 180 and the variability of the low resistance state reaches values below 5%. Exsolution is applied for the first time to engineer solid–solid interfaces extending its realm of application to electronic devices. Abstract : A new fabrication route for nanoparticle integration into memristive devices is introduced. Ni nanoparticles are formed by exsolution from the bottom electrode perovskite thin film. The particles confine the conductive filaments reducing the cycle‐to‐cycle variability and increasing the ON/OFF ratio of the device during operation.