Investigation on Ag‐containing compound generated in manufacturing of low‐temperature polycrystalline Si active matrix organic light‐emitting diode. Issue 10 (8th April 2020)

• Record Type: Journal Article
• Authors: Jin, Yu; Fu, Dongzhi; Lee, Julong; Wang, Enlai; Lu, Yunlei; Xi, Wangfeng; Jiang, Jijun; Zhu, Yangjie; Zhao, Xuan; Liu, Bin
• Is Part Of: Journal of the Society for Information Display. Volume 28:Issue 10(2020)
• Page Start: 808
• Page End: 824
• Publication Date: 2020-04-08
• Subjects: Ag‐containing compound -- LTPS‐AMOLED -- reliability failure -- responding to electric fields; Information display systems -- Periodicals; 621.38154205
• DOI: 10.1002/jsid.895
• Languages: English
• ISSNs: 1071-0922

Abstract

Abstract: In this work, we report a systematic investigation on Ag‐containing compound widely generated in anode wet etching process of low‐temperature polycrystalline Si active matrix organic light‐emitting diode (LTPS‐AMOLED). The formation mechanism of the aforementioned compound was proposed and confirmed by sufficient evidence. The relevant test results show that, unlike traditional metal compounds, this compound cannot be removed by aqueous oxalic acid solution. Furthermore, the reported Ag‐containing compounds grow and migrate in response to electric fields in high‐temperature and high‐humidity environment (85°C, 85% humidity) to short neighboring integrated circuit pads, causing severe product reliability failure. Spectra test results indicate that products with reliability failure are characterized by reduced display brightness and shifted color coordinates. To improve the reliability failure caused by Ag‐containing compounds, five potential schemes are presented, and most of them are conducted in this study. Abstract : During anode etching process of LTPS‐AMOLED array backplane fabrication, Ag‐containing compound will widely form on the surface of IC pad. The Ag‐containing compound will grow and migrate in response to electric filed in a high‐temperature and high‐humidity environment, and its migration direction is consistent with the direction of the electric field.