Cause analysis of the faults in HARC etching processes by using the PI‐VM model for OLED display manufacturing. Issue 9 (27th June 2019)
- Record Type:
- Journal Article
- Title:
- Cause analysis of the faults in HARC etching processes by using the PI‐VM model for OLED display manufacturing. Issue 9 (27th June 2019)
- Main Title:
- Cause analysis of the faults in HARC etching processes by using the PI‐VM model for OLED display manufacturing
- Authors:
- Park, Seolhye
Kyung, Yunyoung
Lee, Juyoung
Jang, Yongsuk
Cha, Taewon
Noh, Yeongil
Choi, Younghoon
Kim, Byungsoo
Cho, Taeyoung
Seo, Rabul
Yang, Jae‐Ho
Jang, Yunchang
Ryu, Sangwon
Kim, Gon‐Ho - Other Names:
- Hamaguchi Satoshi guestEditor.
Agarwal Sumit guestEditor.
Zajickova Lenka guestEditor. - Abstract:
- Abstract: High‐aspect ratio contact (HARC) etching is a bottleneck step of the high‐definition organic light emitting diode (OLED) display manufacturing processes. HARC process is frequently failed during the mass production, because this requires the high‐energy ion flux and the sidewall passivation, simultaneously. To analyze the cause of HARC process failures, plasma information (PI)‐based virtual metrology (VM) algorithm was developed by using the equipment engineering system and the optical emission spectroscopy data recorded from the fab. Developed PI‐VM could predict the process faults with >90% of the accuracy, and the cause analysis function was also validated. We could suggest a right solution to the failure, and more efficient management of the OLED display manufacturing was possible. Abstract : Highly contributed plasma information (PI) parameters to the decision of process failed and succeeded glasses in the virtual metrology model were applied to the root cause analysis of the high‐aspect ratio contact (HARC) etching process faults. Analyzed causes could be a guideline of the mass production control and management in the organic light emitting diodes (OLED) display manufacturing fab.
- Is Part Of:
- Plasma processes and polymers. Volume 16:Issue 9(2019)
- Journal:
- Plasma processes and polymers
- Issue:
- Volume 16:Issue 9(2019)
- Issue Display:
- Volume 16, Issue 9 (2019)
- Year:
- 2019
- Volume:
- 16
- Issue:
- 9
- Issue Sort Value:
- 2019-0016-0009-0000
- Page Start:
- n/a
- Page End:
- n/a
- Publication Date:
- 2019-06-27
- Subjects:
- cause analysis -- dry etch -- fault prediction -- plasma information -- virtual metrology
Plasma polymerization -- Periodicals
Plasma-enhanced chemical vapor deposition -- Periodicals
Plasma chemistry -- Periodicals - Journal URLs:
- http://onlinelibrary.wiley.com/journal/10.1002/(ISSN)1612-8869 ↗
http://www3.interscience.wiley.com/cgi-bin/jtoc/106571203 ↗
http://onlinelibrary.wiley.com/ ↗ - DOI:
- 10.1002/ppap.201900030 ↗
- Languages:
- English
- ISSNs:
- 1612-8850
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 6528.781000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 14244.xml