Cite
HARVARD Citation
Wu, X. et al. (2019). 3D Electronics: 3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics (Adv. Electron. Mater. 7/2019). Advanced Electronic Materials. p. n/a. [Online].
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Wu, X. et al. (2019). 3D Electronics: 3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics (Adv. Electron. Mater. 7/2019). Advanced Electronic Materials. p. n/a. [Online].