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HARVARD Citation
El‐Atab, N. et al. (2019). Bi‐Facial Substrates Enabled Heterogeneous Multi‐Dimensional Integrated Circuits (MD‐IC) for Internet of Things (IoT) Applications. Advanced engineering materials. 21 (7), p. n/a. [Online].
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El‐Atab, N. et al. (2019). Bi‐Facial Substrates Enabled Heterogeneous Multi‐Dimensional Integrated Circuits (MD‐IC) for Internet of Things (IoT) Applications. Advanced engineering materials. 21 (7), p. n/a. [Online].