Cite
HARVARD Citation
Ren, X. et al. (2020). Molecular dynamics simulation of thermal welding morphology of Ag/Au/Cu nanoparticles distributed on Si substrates. Ferroelectrics. pp. 19-27. [Online].
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Ren, X. et al. (2020). Molecular dynamics simulation of thermal welding morphology of Ag/Au/Cu nanoparticles distributed on Si substrates. Ferroelectrics. pp. 19-27. [Online].