Impact of electrode geometry and thickness on planar on-chip microsupercapacitors. Issue 52 (26th August 2020)

• Record Type: Journal Article
• Authors: Vyas, Agin; Wang, Kejian; Li, Qi; Saleem, Amin M.; Bylund, Maria; Andersson, Rickard; Desmaris, Vincent; Smith, Anderson; Lundgren, Per; Enoksson, Peter
• Is Part Of: RSC advances. Volume 10:Issue 52(2020)
• Page Start: 31435
• Page End: 31441
• Publication Date: 2020-08-26
• Subjects: Chemistry -- Periodicals; 540.5
• DOI: 10.1039/d0ra05488g
• Languages: English
• ISSNs: 2046-2069

Abstract

Abstract : We present an in-depth analysis of the impact of geometry and carbon nanofiber thickness on CMOS compatible microsupercapacitor performance. Abstract : We report an assessment of the influence of both finger geometry and vertically-oriented carbon nanofiber lengths in planar micro-supercapacitors. Increasing the finger number leads to an up-scaling in areal power densities, which increases with scan rate. Growing the nanofibers longer, however, does not lead to a proportional growth in capacitance, proposedly related to limited ion penetration of the electrode.