Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink. (25th May 2020)
- Record Type:
- Journal Article
- Title:
- Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink. (25th May 2020)
- Main Title:
- Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink
- Authors:
- Lin, Xiaohui
Mo, Songping
Mo, Bingzhong
Jia, Lisi
Chen, Ying
Cheng, Zhengdong - Abstract:
- Highlights: Nanofluid-cooled microchannel heat sink and thermoelectric cooler are integrated. Cooling performance is tested under wide range of temperature conditions. The proposed system shows good cooling performance for high-power LED. The proposed system shows good cooling performance at high ambient temperature. Using nanofluids instead of water as coolant improves thermal management. Abstract: Effective thermal management for light-emitting diodes (LEDs) is critical, as temperature significantly affects their lifetime and performance. In this study, a system combining a thermoelectric cooler (TEC) and a microchannel heat sink (MHS) is investigated experimentally for thermal management of high-power LEDs. Nanofluids and water are used as coolant. The LED substrate temperature ( T s ) is measured at various TEC powers, nanofluid concentrations, ambient temperatures of LED ( T a ), and ambient temperatures of the fluid radiator ( T a, f ). The effective thermal resistance ( R s-fa ) of the LED substrate to the ambient of the fluid radiator is analyzed. Correlations of T s and R s-fa are obtained. Results show that the T s is lowest when the TEC works at its rated power, and T s is lower than T a at T a ≥ 55 °C. Using nanofluids instead of water as coolant reduces the T s by up to 18.5 °C and decreases the thermal resistance by as much as 42.4%. The MHS heat transfer capacity is increased by 38.6%. The T a, f exhibites greater influence on T s compared to T a . ResultsHighlights: Nanofluid-cooled microchannel heat sink and thermoelectric cooler are integrated. Cooling performance is tested under wide range of temperature conditions. The proposed system shows good cooling performance for high-power LED. The proposed system shows good cooling performance at high ambient temperature. Using nanofluids instead of water as coolant improves thermal management. Abstract: Effective thermal management for light-emitting diodes (LEDs) is critical, as temperature significantly affects their lifetime and performance. In this study, a system combining a thermoelectric cooler (TEC) and a microchannel heat sink (MHS) is investigated experimentally for thermal management of high-power LEDs. Nanofluids and water are used as coolant. The LED substrate temperature ( T s ) is measured at various TEC powers, nanofluid concentrations, ambient temperatures of LED ( T a ), and ambient temperatures of the fluid radiator ( T a, f ). The effective thermal resistance ( R s-fa ) of the LED substrate to the ambient of the fluid radiator is analyzed. Correlations of T s and R s-fa are obtained. Results show that the T s is lowest when the TEC works at its rated power, and T s is lower than T a at T a ≥ 55 °C. Using nanofluids instead of water as coolant reduces the T s by up to 18.5 °C and decreases the thermal resistance by as much as 42.4%. The MHS heat transfer capacity is increased by 38.6%. The T a, f exhibites greater influence on T s compared to T a . Results show that favorable performance of the thermal management of the high-power LED is obtained by the proposed nanofluid-cooled TEC-MHS system, particularly at high ambient temperature of LED. … (more)
- Is Part Of:
- Applied thermal engineering. Volume 172(2020)
- Journal:
- Applied thermal engineering
- Issue:
- Volume 172(2020)
- Issue Display:
- Volume 172, Issue 2020 (2020)
- Year:
- 2020
- Volume:
- 172
- Issue:
- 2020
- Issue Sort Value:
- 2020-0172-2020-0000
- Page Start:
- Page End:
- Publication Date:
- 2020-05-25
- Subjects:
- Thermal management -- LED -- Thermoelectric cooler -- Microchannel heat sink -- Nanofluid -- Thermal resistance
Heat engineering -- Periodicals
Heating -- Equipment and supplies -- Periodicals
Periodicals
621.40205 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13594311 ↗
http://www.elsevier.com/homepage/elecserv.htt ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.applthermaleng.2020.115165 ↗
- Languages:
- English
- ISSNs:
- 1359-4311
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
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- British Library DSC - 1580.101000
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