Effect of post-bond heat treatment on microstructure and mechanical properties of the wide gap TLP bonded IC10 superalloy with a low boron Ni3Al-based interlayer. (June 2020)

• Record Type: Journal Article
• Authors: Yue, Xiong; Liu, Fengmei; Li, Qi; Qin, Hongbo; Gao, Haitao; Li, Likun; Yi, Yaoyong
• Is Part Of: Journal of manufacturing processes. Volume 54(2020)
• Page Start: 109
• Page End: 119
• Publication Date: 2020-06
• Subjects: Ni3Al-based superalloy IC10 -- TLP bonding -- Low boron Ni3Al-based interlayer; Production management -- Data processing -- Periodicals; Manufacturing processes -- Periodicals; Procestechnologie; Productietechniek; Production -- Gestion -- Informatique -- Périodiques; Fabrication -- Périodiques; Manufacturing processes; Production management -- Data processing; Periodicals; 670.5
• DOI: 10.1016/j.jmapro.2020.03.002
• Languages: English
• ISSNs: 1526-6125

Abstract

Abstract: Transient liquid phase (TLP) bonding of directionally solidified Ni3 Al-based superalloy IC10 was carried out using a low boron Ni3 Al-based interlayer. The microstructure of TLP-bonded joints was analyzed by a scanning electron microscope and electron backscatter diffraction technique. The effects of the base metal dissolution, isothermal solidification and post-bond heat treatment on the migration of the main element in the interlayer and base metal were characterized. And a new design method of interlayer composition for TLP bonding superalloy is proposed. When the gap size is 0.08 mm, the ultimate tensile strength of the joint at 1100 °C after the PBHT is 268 MPa, which is 97 % of the base metal, the creep time of TLP-bonded joint at 1100 °C/ 36 MPa is more than 100 h, which is more than 90 % of the base metal. The crack initiated from the microvoids and appeared at the edge of the borides and carbides as well as the edge of the γ+γ' eutectic.