A review on epoxy-based electrically conductive adhesives. (June 2020)

• Record Type: Journal Article
• Authors: Aradhana, Ruchi; Mohanty, Smita; Nayak, Sanjay Kumar
• Is Part Of: International journal of adhesion & adhesives. Volume 99(2020)
• Publication Date: 2020-06
• Subjects: Electrically conductive adhesives (ECAs) -- Epoxy resin -- Conduction mechanism -- Conductive fillers -- Inherently conductive polymers; Adhesion -- Periodicals; Adhesives -- Periodicals; Adhésion (Physique) -- Périodiques; Adhésifs -- Périodiques; Adhesie; Kleefstoffen; Adhesion; Adhesives; Periodicals; 668.3
• DOI: 10.1016/j.ijadhadh.2020.102596
• Languages: English
• ISSNs: 0143-7496

Abstract

Abstract: Electrically conductive adhesives (ECAs) are widely utilized in various electronic packaging applications including die fitting, solderless interconnections, component renovation, display interconnections, and heat dissipation, etc. ECAs seize attention of scientific researchers as green and sustainable lead-free interconnection material over conventional solders owing to their eco-friendliness, processing capability at low temperature, fewer processing steps, negligible stress on a substrate, flexibility and stretchability, and cost-effectiveness. Various researchers worked in the area of epoxy based conductive adhesives mainly focusing on the categories, conduction mechanisms, applications of conductive adhesives along with various types of conductive fillers, inherent conductive polymers and future prospective of epoxy resin in the field of conductive adhesives is presented. Graphical abstract: Image 1