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HARVARD Citation
Vallepuga-Espinosa, J. et al. (2020). A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging. Engineering analysis with boundary elements. pp. 28-39. [Online].
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Vallepuga-Espinosa, J. et al. (2020). A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging. Engineering analysis with boundary elements. pp. 28-39. [Online].