Microstructure evolution of Cu-1.0Co-0.65Si-0.1Ti alloy during hot deformation. (July 2020)
- Record Type:
- Journal Article
- Title:
- Microstructure evolution of Cu-1.0Co-0.65Si-0.1Ti alloy during hot deformation. (July 2020)
- Main Title:
- Microstructure evolution of Cu-1.0Co-0.65Si-0.1Ti alloy during hot deformation
- Authors:
- Geng, Yongfeng
Li, Xu
Zhang, Yi
Jia, Yanlin
Zhou, Honglei
Tian, Baohong
Liu, Yong
Volinsky, Alex A.
Zhang, Xiaohui
Song, Kexing
Liu, Ping
Chen, Xiaohong - Abstract:
- Abstract: The Cu-1.0Co-0.65Si-0.1Ti alloy was obtained by vacuum melting, and then the hot deformation experiment was carried out by using the Gleeble-1500 simulator at 0.001–10 s −1 strain rates and 500–900 °C deformation temperatures. The microstructure evolution of Cu-1.0Co-0.65Si-0.1Ti alloy was discussed. The micro texture of Cu-1.0Co-0.65Si-0.1Ti alloy was analyzed by EBSD. With the deformation temperature increasing from 700 to 800 °C, the dynamic recrystallization was promoted and the texture of Cu-1.0Co-0.65Si-0.1Ti alloy transformed from the {011} <100> Goss texture to the {112} <111> copper texture. The HAGBs and geometrically necessary dislocation (GND) density were calculated, respectively, which can also indicate that the increasing of temperature promoted the dynamic recrystallization. The critical strain for the initiation of dynamic recrystallization in Cu-Co-Si-Ti alloy deformed at 0.01 s −1, 800 °C and 0.001 s −1, 800 °C was 0.089 and 0.035, respectively. And it can be inferred that the increasing of deformation temperature or decreasing of strain rate can reduce the critical strain and promote the dynamic recrystallization. Finally, the precipitate was determined to be Co2 Si. Graphical abstract: Image 1 Highlights: Hot deformation behavior of the Cu-Co-Si-Ti alloy was investigated. The texture evolution was obtained from the pole figures and inverse pole figures. The geometrically necessary dislocation (GND) density was calculated.
- Is Part Of:
- Vacuum. Volume 177(2020)
- Journal:
- Vacuum
- Issue:
- Volume 177(2020)
- Issue Display:
- Volume 177, Issue 2020 (2020)
- Year:
- 2020
- Volume:
- 177
- Issue:
- 2020
- Issue Sort Value:
- 2020-0177-2020-0000
- Page Start:
- Page End:
- Publication Date:
- 2020-07
- Subjects:
- Cu-1.0Co-0.65Si-0.1Ti alloy -- Hot compression -- Flow stress -- Microstructure evolution
Vacuum -- Periodicals
621.55 - Journal URLs:
- http://www.elsevier.com/journals ↗
http://www.sciencedirect.com/science/journal/0042207X ↗ - DOI:
- 10.1016/j.vacuum.2020.109376 ↗
- Languages:
- English
- ISSNs:
- 0042-207X
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 9139.000000
British Library DSC - BLDSS-3PM
British Library STI - ELD Digital store - Ingest File:
- 13402.xml