Cite
HARVARD Citation
Yuan, S. et al. (2020). Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation. Tribology international. p. . [Online].
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Yuan, S. et al. (2020). Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation. Tribology international. p. . [Online].