Cite
HARVARD Citation
Xiong, W. et al. (2020). A 3D numerical study of a molten solder droplet's wetting and solidifying on a pillar with application to electronic packaging. International journal of heat and mass transfer. p. . [Online].
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Xiong, W. et al. (2020). A 3D numerical study of a molten solder droplet's wetting and solidifying on a pillar with application to electronic packaging. International journal of heat and mass transfer. p. . [Online].