Tailoring chip morphology by correlating the microstructure and dynamic yield strength in turning of lead-free silicon brasses. (May 2020)

• Record Type: Journal Article
• Authors: Yang, Chao; Yang, Yuchuan; Liang, Liang; Lin, Guozhi
• Is Part Of: Journal of manufacturing processes. Volume 53(2020)
• Page Start: 420
• Page End: 430
• Publication Date: 2020-05
• Subjects: Silicon brass -- Microstructure -- Chip morphology -- Yield stress -- Cutting; Production management -- Data processing -- Periodicals; Manufacturing processes -- Periodicals; Procestechnologie; Productietechniek; Production -- Gestion -- Informatique -- Périodiques; Fabrication -- Périodiques; Manufacturing processes; Production management -- Data processing; Periodicals; 670.5
• DOI: 10.1016/j.jmapro.2020.03.036
• Languages: English
• ISSNs: 1526-6125

Abstract

Abstract: In this work, we reported a framework to quantitatively evaluate and tailor chip breaking capability by correlating the microstructure and dynamic yield strength in cutting of α+β silicon brasses. The microstructure of the silicon brasses was controlled by designing the elements compositions and resultant α and β contents by zinc equivalent rule. Increasing β content leaded monotonously to the increase in the quasi-static tensile yield strength. In contrast, the dynamic yield strength ( σ d ) determined by J.G. William's cutting model had a sudden drop regime for the α+β silicon brasses with the increased zinc equivalent. Exactly, the easy chip breaking capability was achieved for the α+β silicon brasses with the sudden-drop σ d, which was associated to the dominant thermal-softening behavior compared with the strain hardening one during the chip formation process for the brasses with the predominant α phase. Specifically, we proposed the methodology that adopts the σ d as an index to evaluate and tailor the easy chip breaking capability of the α+β silicon brasses. This work substantiated the methodology of correlating the microstructure control via the composition design and the σ d determined from the chip geometric parameters could be utilized to evaluate and tailor chip breaking capability of metallic materials.