Temperature‐dependent analysis of crosstalk and delay uncertainty in multilayer graphene nanoribbon interconnects. Issue 6 (27th May 2020)

• Record Type: Journal Article
• Authors: Mona Chanu, Waikhom; Das, Debaprasad
• Is Part Of: Engineering reports. Volume 2:Issue 6(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-05-27
• Subjects: crosstalk -- delay uncertainty -- effective mean free path -- interconnect -- SC‐MLGNR -- TC‐MLGNR; Engineering -- Periodicals; Computer science -- Periodicals; 620.005
• DOI: 10.1002/eng2.12185
• Languages: English
• ISSNs: 2577-8196

Abstract

Summary: In this article, we have analyzed delay uncertainty due to crosstalk in multilayer graphene nanoribbon (MLGNR) interconnects. Crosstalk is a challenging problem in deep‐sub‐micron and nanometer designs. In this work, we have analyzed the crosstalk delay with a wide variation in chip operating temperature. The mean free path is modeled as a function of temperature. Furthermore, the resistance of MLGNR interconnect system is modeled. Crosstalk delay analysis is performed for both top‐contact MLGNR and side‐contact MLGNR (SC‐MLGNR) interconnects and compared the results with that of the traditional Cu interconnects. The analysis has been carried out for different interconnect widths 11, 16, and 22 nm and lengths 10, 50, and 100 μm for three different chip operating temperatures 233, 300, and 398K. The decrease in rise/fall delay (speed up) and increase in rise/fall time delay (slow down) are modeled. Finally, the delay uncertainty is modeled for different interconnect systems. The percentage change in delay values for speed up and slow down cases are −23.4 %, −29.8 % and 114.4 %, 161.9 %, respectively, for 10μm SC‐MLGNR interconnect. It is shown that the delay uncertainty is significantly less in SC‐MLGNR interconnects and with the advancement of technology the performance is improved as compared with copper interconnects. Abstract : Crosstalk delay analysis is performed for both top‐contact MLGNR (TC‐MLGNR) and side‐contact MLGNR (SC‐MLGNR). The analysis has been carried out for different interconnect widths and lengths for three different chip operating temperature 233, 300, and 398K. The decrease in rise/fall delay (speedup) and increase in rise/fall time delay (slowdown) are modeled.