Nondestructive rapid and quantitative analysis for the curing process of silicone resin by near‐infrared spectra. Issue 34 (17th January 2020)

• Record Type: Journal Article
• Authors: Yang, Jian; Zhang, Tong; Yin, Yue; Jiang, Wenhong; Du, Yunzhe; Zhu, Xiaofei; Jiang, Bo; Huang, Yudong
• Is Part Of: Journal of applied polymer science. Volume 137:Issue 34(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-01-17
• Subjects: cross‐linking -- resins -- spectroscopy; Polymers -- Periodicals; Polymerization -- Periodicals; 668.9
• DOI: 10.1002/app.48982
• Languages: English
• ISSNs: 0021-8995

Abstract

Abstract: Reactive group content was a key parameter in polymer curing process. However, the conventional methods to measure the curing were destructive and time consuming. In this article, near‐infrared spectra technology had been applied for reactive group analysis of the photothermal curing silicone to achieve rapid nondestructive and quantitative detection. The calibration model was developed about epoxy value and CC double bond value, with determination coefficient ( R 2 ) of 0.9631 and 0.9689. Root mean square error of prediction were 0.0179 and 0.0143 by partial least square regression. The optimized calibration model was used to predict the content of epoxy value and CC double bond value in the photothermal curing process, it proved that the silicone resin cured under UV‐radiation and heat. This novel method provided a promising approach to analysis the curing mechanism and quality parameters of resin. Abstract :