Properties of glass/epoxy sandwich structure for electronic boards. Issue 3 (27th March 2020)

• Record Type: Journal Article
• Authors: Pietrikova, Alena; Lenger, Tomas; Fricova, Olga; Popovic, Lubos; Livovsky, Lubomir
• Is Part Of: Microelectronics international. Volume 37:Issue 3(2020)
• Page Start: 139
• Page End: 146
• Publication Date: 2020-03-27
• Subjects: Thermomechanical analysis -- Dynamic mechanical analysis -- Glass/epoxy sandwich structure -- Three-point bending method; Microelectronics -- Periodicals; 621.381
• DOI: 10.1108/MI-12-2019-0084
• Languages: English
• ISSNs: 1356-5362

Abstract

Abstract : Purpose: This study aims to characterize a novel glass/epoxy architecture sandwich structure for electronic boards. Understanding the thermo-mechanical behavior of these composites is important because it is possible to pre-determine whether defined "internal" thick laminates will be suitable for embedding components in the direction of the axis "z, " i.e. this method of manufacturing multilayer laminates can be used for incoming miniaturization in electronics. Design/methodology/approach: Laminates with a low glass transition temperature (Tg) and high Tg with E-glass type were treated, tested and compared. Testing samples were manufactured by nonstandard two steps unidirectional lamination as a multilayer structure based on prepreg layers and as "a sandwich structure" to explore its effect on thermo-mechanical properties. The proposed tested method determines the time and temperature-dependent viscoelastic properties of the board by using dynamic mechanical analysis, thermo-mechanical analysis and three-point bend tests. Findings: This testing method was chosen because the main property that promotes sandwich structure is their high stiffness. Glass/epoxy stiff and thermal stabile sandwich structure prepared by nonstandard two-stage lamination is proper for embedding components and the next miniaturization in electronics. Originality/value: Compared with by-default applied glass-reinforced homogenous laminates, novel architecture sandwich structure is attractive because of a combination of strength, stiffness and all while maintaining the miniaturization requirement and multifunctional application in electronics.