Additive manufacturing revolution in ceramic microsystems. Issue 2 (28th March 2020)

• Record Type: Journal Article
• Authors: Nawrot, Witold; Malecha, Karol
• Is Part Of: Microelectronics international. Volume 37:Issue 2(2020)
• Page Start: 79
• Page End: 85
• Publication Date: 2020-03-28
• Subjects: 3D printing -- Additive manufacturing -- Ceramics -- Low-temperature cofired ceramics (LTCC) -- Photocurable resin -- Stereolithography; Microelectronics -- Periodicals; 621.381
• DOI: 10.1108/MI-11-2019-0073
• Languages: English
• ISSNs: 1356-5362

Abstract

Abstract : Purpose: The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities. Design/methodology/approach: A short introduction into additive techniques is included, as well as primary characterization of structuring capabilities, dielectric performance and applicability in the electronic manufacturing process. Findings: Ceramic stereolithography (SLA) is suitable for microchannel manufacturing, even using a relatively inexpensive system. This method is suitable for implementation into the electronic manufacturing process; however, a search for better materials is desired, especially for improved dielectric parameters, lowered sintering temperature and decreased porosity. Practical implications: Relatively inexpensive ceramic SLA, which is now available, could make ceramic electronics, currently restricted to specific applications, more available. Originality/value: Ceramic AM is in the beginning phase of implementation in electronic technology, and only a few reports are currently available, the most significant of which is mentioned in this paper.