Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation. Issue 7 (July 2018)

• Record Type: Journal Article
• Authors: Zhu, Y.K.; Chen, Q.Y.; Wang, Q.; Yu, H.Y.; Li, R.; Hou, J.P.; Zhang, Z.J.; Zhang, G.P.; Zhang, Z.F.
• Is Part Of: Journal of materials science & technology. Volume 34:Issue 7(2018)
• Page Start: 1214
• Page End: 1221
• Publication Date: 2018-07
• Subjects: Commercially pure aluminum wire -- Cold drawing -- Texture -- Finite element simulation -- Stress profile; Metals -- Periodicals; Materials science -- Periodicals; Materials science; Metals; Periodicals; 620.1105
• DOI: 10.1016/j.jmst.2017.07.011
• Languages: English
• ISSNs: 1005-0302

Abstract

Abstract: The evolution of microstructure in the drawing process of commercially pure aluminum wire (CPAW) does not only depend on the nature of materials, but also on the stress profile. In this study, the effect of stress profile on the texture evolution of the CPAW was systematically investigated by combining the numerical simulation and the microstructure observation. The results show that the tensile stress at the wire center promotes the formation of <111> texture, whereas the shear stress nearby the rim makes little contribution to the texture formation. Therefore, the <111> texture at the wire center is stronger than that in the surface layer, which also results in a higher microhardness at the center of the CPAW under axial loading.