Cite
HARVARD Citation
Koontz, J. et al. (2020). Temperature and pH affect copper release kinetics from copper metal foil and commercial copperware to food simulants. Food additives & contaminants. 37 (3), pp. 465-477. [Online].
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Koontz, J. et al. (2020). Temperature and pH affect copper release kinetics from copper metal foil and commercial copperware to food simulants. Food additives & contaminants. 37 (3), pp. 465-477. [Online].