Boosting the Heat Dissipation Performance of Graphene/Polyimide Flexible Carbon Film via Enhanced Through‐Plane Conductivity of 3D Hybridized Structure. Issue 8 (30th January 2020)

• Record Type: Journal Article
• Authors: Li, Yanhua; Zhu, Yanfei; Jiang, Gaopeng; Cano, Zachary P.; Yang, Jun; Wang, Jin; Liu, Jilei; Chen, Xiaohua; Chen, Zhongwei
• Is Part Of: Small. Volume 16:Issue 8(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-01-30
• Subjects: flexible carbon films -- graphene oxide -- heat sinks -- polyimide pulp -- thermal conductivity; Nanotechnology -- Periodicals; Nanoparticles -- Periodicals; Microtechnology -- Periodicals; 620.5
• DOI: 10.1002/smll.201903315
• Languages: English
• ISSNs: 1613-6810

Abstract

Abstract: The development of materials with efficient heat dissipation capability has become essential for next‐generation integrated electronics and flexible smart devices. Here, a 3D hybridized carbon film with graphene nanowrinkles and microhinge structures by a simple solution dip‐coating technique using graphene oxide (GO) on polyimide (PI) skeletons, followed by high‐temperature annealing, is constructed. Such a design provides this graphitized GO/PI (g‐GO/PI) film with superflexibility and ultrahigh thermal conductivity in the through‐plane (150 ± 7 W m ‐1 K ‐1 ) and in‐plane (1428 ± 64 W m ‐1 K ‐1 ) directions. Its superior thermal management capability compared with aluminum foil is also revealed by proving its benefit as a thermal interface material. More importantly, by coupling the hypermetallic thermal conductivity in two directions, a novel type of carbon film origami heat sink is proposed and demonstrated, outperforming copper foil in terms of heat extraction and heat transfer for high‐power devices. The hypermetallic heat dissipation performance of g‐GO/PI carbon film not only shows its promising application as an emerging thermal management material, but also provides a facile and feasible route for the design of next‐generation heat dissipation components for high‐power flexible smart devices. Abstract : A 3D hybridized nanostructure carbon film, graphitized graphene oxide on polyimide (g‐GO/PI), with superflexibility, foldability, and ultrahigh thermal conductivity of both in the through‐plane direction and in‐plane direction is developed. These encouraging properties empower g‐GO/PI film with hypermetallic heat dissipation capability in terms of thermal interface material (TIM) and origami heat sink.