Cosimulation of Power and Temperature Models at the SystemC/TLM for a Soft-Core Processor. (11th February 2020)

• Record Type: Journal Article
• Authors: El Hariti, Zineb; Alali, Abdelhakim; Sadik, Mohamed; Aamali, Kaoutar
• Other Names: Di Benedetto Luigi Academic Editor.
• Is Part Of: Advances in materials science and engineering. Volume 2020(2020)
• Publication Date: 2020-02-11
• Subjects: Materials science -- Periodicals; Materials science; Periodicals; 620.11
• DOI: 10.1155/2020/2567915
• Languages: English
• ISSNs: 1687-8434

Abstract

Abstract : Nowadays, modern embedded applications are becoming more and more complex and resource demanding. Fortunately, Systems on Chip (SoC) are one of the keys used to follow their requirements that stand in need of high performance while maintaining a low-power profile. On one hand, today, due to the limited power budget imposed by the batteries, power is the limiting factor of the logic CMOS. On the other hand, the downscaling of the technology node for 65 nm and beyond, based on the International Technology Roadmap for Semiconductors (ITRS) as a reference, has not only resulted in huge energy consumption but also increased the temperature chip. To address this challenge, designing at the system level is the suitable measure to tackle with the complexity of the Systems on Chip, aiming at having better adjustment between timing and accuracy for power and temperature estimations. We present in this paper, at the first stage, two models describing the static and dynamic power at the physical level. These models are implemented on an open virtual platform Model Power-Consumption and Temperature in SystemC/TLM (LIBTLMPWT) based on a representative SoC architecture. At the second stage, we focus on power, especially the thermal behaviour of the chip while running three benchmarks set on the game of life application for two different technology nodes.