Evidence for Ag participating the electrochemical migration of 96.5Sn-3Ag-0.5Cu alloy. (1st August 2019)

• Record Type: Journal Article
• Authors: Zhong, Xiankang; Lu, Wenjun; Liao, Bokai; Medgyes, Bálint; Hu, Junying; Zheng, Yan; Zeng, Dezhi; Zhang, Zhi
• Is Part Of: Corrosion science. Volume 156(2019)
• Page Start: 10
• Page End: 15
• Publication Date: 2019-08-01
• Subjects: A. Tin -- B. STEM -- C. Anodic dissolution; Corrosion and anti-corrosives -- Periodicals; 620.11223
• DOI: 10.1016/j.corsci.2019.05.004
• Languages: English
• ISSNs: 0010-938X

Abstract

Graphical abstract: Highlights: Ag can participate the electrochemical migration of 96.5Sn-3Ag-0.5Cu alloy. The migration of Ag in the case of 96.5Sn-3Ag-0.5Cu alloy is potential-dependent. Ag co-exists with Sn and Cu at the same region of dendrites. Abstract: Ag participating the electrochemical migration (ECM) of Sn-Ag based alloys is still controversial. In this work, Ag + concentration in electrolyte layer and Ag distribution in dendrites formed during the ECM of 96.5Sn-3Ag-0.5Cu alloy were investigated using Inductively Coupled Plasma Source Mass Spectrometer and Scanning Transmission Electron Microscopy, respectively. Results show that Ag + can only be detected when Ag can release from Ag3 Sn during the anodic polarization of 96.5Sn-3Ag-0.5Cu alloy. Under such a condition, Ag could also be found in dendrites. Therefore, it can be concluded that Ag participates the ECM of 96.5Sn-3Ag-0.5Cu alloy, but it is potential-dependent.