Cite
HARVARD Citation
Ding, Z. et al. (2018). A reconfiguring and self-healing thermoset epoxy/chain-extended bismaleimide resin system with thermally dynamic covalent bonds. Polymer. pp. 170-182. [Online].
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Ding, Z. et al. (2018). A reconfiguring and self-healing thermoset epoxy/chain-extended bismaleimide resin system with thermally dynamic covalent bonds. Polymer. pp. 170-182. [Online].