Atomic Force Microscope‐Based Meniscus‐Confined Three‐Dimensional Electrodeposition. Issue 2 (9th January 2020)

• Record Type: Journal Article
• Authors: Eliyahu, David; Gileadi, Eliezer; Galun, Ehud; Eliaz, Noam
• Is Part Of: Advanced materials technologies. Volume 5:Issue 2(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-01-09
• Subjects: atomic force microscope (AFM) -- copper -- electrochemistry -- meniscus‐confined electrodeposition (MCED) -- three‐dimensional (3D) printing; Materials science -- Periodicals; Technological innovations -- Periodicals; Materials science; Technological innovations; Periodicals; 620.1105
• DOI: 10.1002/admt.201900827
• Languages: English
• ISSNs: 2365-709X

Abstract

Abstract: The development of a 3D electrochemical deposition system, which combines meniscus‐confined electrodeposition (MCED) with atomic force microscope (AFM) closed‐loop control and has a submicron resolution, is described. Thanks to the high rigidity of the hollow borosilicate glass (or quartz) tip and quartz crystal tuning fork (QTF), combined with the QTF's high force sensitivity, the use of a solution‐filled AFM tip in air is successful. The AFM control enables full automation and in situ growth control. Using this scheme, 3D printing of high‐quality, fully dense, uniform and exceptionally smooth, freestanding straight and overhang pure polycrystalline copper pillars, with diameters ranging from 1.5 µm to 250 nm, and an aspect ratio > 100, is demonstrated. This process may be useful for manufacturing of high‐frequency terahertz antennas, high‐density interconnects, precision sensors, micro‐ and nano‐electromechanical systems, batteries, and fuel cells, as well as for repair or modification of existing micro‐sized or nano‐sized features. Abstract : Electrochemical 3D microprinting system with submicron resolution is developed, combining meniscus‐confined electrodeposition with atomic force microscope closed‐loop control. High‐quality freestanding pillars of pure Cu with exceptionally high strength and high electrical conductivity are printed. This process can be applied to a wide variety of materials and be used in a variety of fabrication, modification, and repair applications.