3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste. (1st April 2020)

• Record Type: Journal Article
• Authors: Chen, Chuantong; Gao, Yue; Liu, Zhi-Quan; Suganuma, Katsuaki
• Is Part Of: Scripta materialia. Number 179(2020)
• Page Start: 36
• Page End: 39
• Publication Date: 2020-04-01
• Subjects: Sintering -- Plating -- Electronic packaging -- 3D pyramid-shape Ag -- Simulation; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2019.12.040
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: Interface connection of sinter micron-sized Ag paste on Cu substrate in a low temperature pressure-less condition was improved by a novel 3D pyramid-shape Ag plating layer which possessed a larger surface area four times than that of a Ag flat plating. Interface connection ratio achieved to 65% corresponding to a satisfied interface bonding strength of 25.3 MPa at 180 °C pressure-less sintering. Finite element model for sinter Ag joining on the 3D pyramid-shape Ag plating was constructed and revealed that stress mainly concentrated at Ag plating protrusions but not at the interface bonding line like the Ag flat plating case. Graphical abstract: Image, graphical abstract