Enhanced thermal conductivity of polydimethylsiloxane composites with carbon fiber. (February 2020)

• Record Type: Journal Article
• Authors: Wei, Jinming; Liao, Meizhen; Ma, Aijie; Chen, Yapeng; Duan, Zehui; Hou, Xiao; Li, Maohua; Jiang, Nan; Yu, Jinhong
• Is Part Of: Composites communications. Volume 17(2020)
• Page Start: 141
• Page End: 146
• Publication Date: 2020-02
• Subjects: Carbon fiber -- Polydimethylsiloxane -- Thermal conductivity
• DOI: 10.1016/j.coco.2019.12.004
• Languages: English
• ISSNs: 2452-2139

Abstract

Abstract: Highly thermal conductive thermal interface materials are playing an irreplaceable role in modern highly integrated microelectronic devices. A facile method was used to fabricate a highly thermal conductive composite combined with highly thermal conductivity and excellent flexibility. The carbon fiber/polydimethylsiloxane (CF/PDMS) composites were prepared by solution blending with PDMS as matrix and different contents CF as thermal conductive fillers. Thermal conductivity of the PDMS composite is up to 2.73 W/mK with 20 wt% CF filler loading. Otherwise, we have characterized the heat transport performance of composites under various conditions. The results indicate that it has very stable and efficient thermal conductivity, which can meet the heat dissipation requirements under various conditions. Therefore, the CF/PDMS composite is a promising thermal management material that can be used to the heat dissipation of electronic devices in the near future. Highlights: High thermal conductivity pitch-based carbon fiber was utilized to enhance the thermal conductivity of the PDMS matrix. A facial and scalable approach was adapted to fabricate the composites. The CF/PDMS composite exhibits excellent heat dissipation performance, flexibility and thermal stability.