Infrared Fingerprint Engineering: A Molecular‐Design Approach to Long‐Wave Infrared Transparency with Polymeric Materials. (23rd October 2019)

• Record Type: Journal Article
• Authors: Kleine, Tristan S.; Lee, Taeheon; Carothers, Kyle J.; Hamilton, Meghan O.; Anderson, Laura E.; Ruiz Diaz, Liliana; Lyons, Nicholas P.; Coasey, Keith R.; Parker, Wallace O.; Borghi, Ludovico; Mackay, Michael E.; Char, Kookheon; Glass, Richard S.; Lichtenberger, Dennis L.; Norwood, Robert A.; Pyun, Jeffrey
• Is Part Of: Angewandte Chemie. Volume 131:Number 49(2019)
• Page Start: 17820
• Page End: 17824
• Publication Date: 2019-10-23
• Subjects: Computersimulationen -- Langwellen-Infrarot-Bildgebung -- Optische Polymere -- Schwefel; Chemistry -- Periodicals; 540
• DOI: 10.1002/ange.201910856
• Languages: English
• ISSNs: 0044-8249

Abstract

Abstract: Optical technologies in the long‐wave infrared (LWIR) spectrum (7–14 μm) offer important advantages for high‐resolution thermal imaging in near or complete darkness. The use of polymeric transmissive materials for IR imaging offers numerous cost and processing advantages but suffers from inferior optical properties in the LWIR spectrum. A major challenge in the design of LWIR‐transparent organic materials is that nearly all organic molecules absorb in this spectral window which lies within the so‐called IR‐fingerprint region. We report on a new molecular‐design approach to prepare high refractive index polymers with enhanced LWIR transparency. Computational methods were used to accelerate the design of novel molecules and polymers. Using this approach, we have prepared chalcogenide hybrid inorganic/organic polymers (CHIPs) with enhanced LWIR transparency and thermomechanical properties via inverse vulcanization of elemental sulfur with new organic co‐monomers. Abstract : Voller Durchblick : Es wird über die Synthese von hybriden anorganisch/organischen Chalkogenid‐Polymeren mit erhöhter Langwellen‐Infrarot(LWIR)‐Transparenz berichtet. Durch Optimierung organischer Moleküle basierend auf DFT‐Berechnungen und IR‐Fingerabdruck‐Engineering wird eine neue Klasse an Polymeren für thermische Bildgebung im LWIR‐Bereich entwickelt.