The effect of anions on the anodic formation of copper sulphide films on copper. (20th January 2020)

• Record Type: Journal Article
• Authors: Martino, T.; Chen, J.; Noël, J.J.; Shoesmith, D.W.
• Is Part Of: Electrochimica acta. Volume 331(2020)
• Publication Date: 2020-01-20
• Subjects: Copper -- Corrosion -- Cyclic voltammetry -- Aqueous sulphide -- Anions; Electrochemistry -- Periodicals; Electrochemistry, Industrial -- Periodicals; 541.37
• DOI: 10.1016/j.electacta.2019.135319
• Languages: English
• ISSNs: 0013-4686

Abstract

Abstract: The influence of anions (Cl −, SO4 2−, HCO3 − ) on the anodic formation of Cu2 S films on Cu was investigated using cyclic voltammetry at rotating disk electrodes. At low ionic strengths, film growth was partially or completely controlled by ionic migration within pores in the growing film depending on the sulphide concentration. At low sulphide concentrations and high ionic strengths, film growth was controlled by the rate of anodic formation of Cu I (as adsorbed Cu(SH)ads ) at the base of pores in the Cu2 S film. The ability of anions to suppress this reaction was in the order SO4 2− > HCO3 − > Cl − . At higher sulphide concentrations, the film porosity was significantly reduced and film growth controlled by the properties of the compact Cu2 S film with ionic migration rate-controlling even at high ionic strength.