Metal-organic frameworks filled epoxy composites: exploring new chances for low-κ polymer dielectrics. Issue 2 (22nd January 2020)

• Record Type: Journal Article
• Authors: Zhao, Yongke; Chen, Guangxin; Zhou, Zheng; Li, Qifang
• Is Part Of: Polymer-plastics technology and materials. Volume 59:Issue 2(2020)
• Page Start: 184
• Page End: 194
• Publication Date: 2020-01-22
• Subjects: Microelectronic -- metal-organic frameworks -- ZIF-8 -- epoxy -- dielectric -- low-κ -- thermal; Polymers -- Periodicals; Polymerization -- Periodicals; Plastics -- Periodicals; Plastics; Polymerization; Polymers; Periodicals; 668
• DOI: 10.1080/25740881.2019.1625393
• Languages: English
• ISSNs: 2574-0881

Abstract

ABSTRACT: Herein, a simple strategy was proposed to explore new chances for low- κ epoxy composites by adding ZIF-8 as additive. Compared with that of pure epoxy sample, the dielectric constant of the epoxy/ZIF-8 composite (0.3 wt%) was decreased to 3.45 from 4.12, the dielectric loss was decreased, the AC electrical resistivity was increased, and the water absorption was decreased from 0.41% to 0.18%. Moreover, the epoxy/ZIF-8 composites possessed improved thermal stability under air atmosphere. Motivated by these results, the ZIF-8 was identified as a promising candidate for preparing low- κ epoxy composite, which maybe get further development in the future. Graphical Abstract: