Efficiency improvement of a DC/DC converter using LTCC substrate. Issue 6 (21st June 2019)

• Record Type: Journal Article
• Authors: Jung, Dong Yun; Jang, Hyun Gyu; Kim, Minki; Park, Junbo; Jun, Chi‐Hoon; Park, Jong Moon; Ko, Sang Choon
• Is Part Of: ETRI journal. Volume 41:Issue 6(2019)
• Page Start: 811
• Page End: 819
• Publication Date: 2019-06-21
• Subjects: DC/DC converter -- efficiency -- low‐temperature co‐fired ceramic -- reliability test -- thermal conductivity; Telecommunication -- Periodicals; Electronics -- Periodicals; Electronics; Telecommunication; Periodicals; Periodicals; 621.38205
• DOI: 10.4218/etrij.2018-0551
• Languages: English
• ISSNs: 1225-6463

Abstract

Abstract : We propose a substrate with high thermal conductivity, manufactured by the low‐temperature co‐fired ceramic (LTCC) multilayer circuit process technology, as a new DC/DC converter platform for power electronics applications. We compare the reliability and power conversion efficiency of a converter using the LTCC substrate with the one using a conventional printed circuit board (PCB) substrate, to demonstrate the superior characteristics of the LTCC substrates. The power conversion efficiencies of the LTCC‐ and PCB‐based synchronous buck converters are 95.5% and 94.5%, respectively, while those of nonsynchronous buck converters are 92.5% and 91.3%, respectively, at an output power of 100 W. To verify the reliability of the LTCC‐based converter, two types of tests were conducted. Storage temperature tests were conducted at −20 °C and 85 °C for 100 h each. The variation in efficiency after the tests was less than 0.3%. A working temperature test was conducted for 60 min, and the temperature of the converter was saturated at 58.2 °C without a decrease in efficiency. These results demonstrate the applicability of LTCC as a substrate for power conversion systems.