Simulation of temperature field, flow field and solidification structure for Ag–28Cu–2Ge–0.4Co alloy. Issue 1 (2nd January 2020)

• Record Type: Journal Article
• Authors: Fang, Ji-Heng; Xie, Ming; Hu, Jie-Qiong; Chen, Yong-Tai; Ma, Hong-Wei; Li, Ai-Kun; Yang, You-Cai
• Is Part Of: Materials science and technology. Volume 36:Issue 1(2020)
• Page Start: 33
• Page End: 45
• Publication Date: 2020-01-02
• Subjects: 3D-CAFE -- temperature field -- flow field -- solidification structure; Materials science -- Periodicals; Microstructure -- Periodicals; Metallurgy -- Periodicals; 620.1105
• DOI: 10.1080/02670836.2019.1675968
• Languages: English
• ISSNs: 0267-0836

Abstract

ABSTRACT: The temperature field, flow field and solidification structure of Ag–28Cu–2Ge–0.4Co alloy during solidification under water cooling, air cooling and slow cooling conditions were investigated, respectively. The results indicate that the temperature distribution is the most uniform and the solid–liquid phase region is the widest under slow cooling condition. The temperature gradient at the solidification front is the largest under water cooling condition. The solidification rate increases with the distance away from the sidewall under three cooling conditions. Under water-cooled conditions, the liquid flow at the front of the liquidus is much smaller than that in the other two conditions. The ratio of equiaxed crystals and columnar crystals in the solidified structure is different under different cooling conditions.