Electrically Robust Single‐Crystalline WTe2 Nanobelts for Nanoscale Electrical Interconnects. Issue 3 (12th December 2018)
- Record Type:
- Journal Article
- Title:
- Electrically Robust Single‐Crystalline WTe2 Nanobelts for Nanoscale Electrical Interconnects. Issue 3 (12th December 2018)
- Main Title:
- Electrically Robust Single‐Crystalline WTe2 Nanobelts for Nanoscale Electrical Interconnects
- Authors:
- Song, Seunguk
Kim, Se‐Yang
Kwak, Jinsung
Jo, Yongsu
Kim, Jung Hwa
Lee, Jong Hwa
Lee, Jae‐Ung
Kim, Jong Uk
Yun, Hyung Duk
Sim, Yeoseon
Wang, Jaewon
Lee, Do Hee
Seok, Shi‐Hyun
Kim, Tae‐il
Cheong, Hyeonsik
Lee, Zonghoon
Kwon, Soon‐Yong - Abstract:
- Abstract: As the elements of integrated circuits are downsized to the nanoscale, the current Cu‐based interconnects are facing limitations due to increased resistivity and decreased current‐carrying capacity because of scaling. Here, the bottom‐up synthesis of single‐crystalline WTe2 nanobelts and low‐ and high‐field electrical characterization of nanoscale interconnect test structures in various ambient conditions are reported. Unlike exfoliated flakes obtained by the top‐down approach, the bottom‐up growth mode of WTe2 nanobelts allows systemic characterization of the electrical properties of WTe2 single crystals as a function of channel dimensions. Using a 1D heat transport model and a power law, it is determined that the breakdown of WTe2 devices under vacuum and with AlO x capping layer follows an ideal pattern for Joule heating, far from edge scattering. High‐field electrical measurements and self‐heating modeling demonstrate that the WTe2 nanobelts have a breakdown current density approaching ≈100 MA cm −2, remarkably higher than those of conventional metals and other transition‐metal chalcogenides, and sustain the highest electrical power per channel length (≈16.4 W cm −1 ) among the interconnect candidates. The results suggest superior robustness of WTe2 against high‐bias sweep and its possible applicability in future nanoelectronics. Abstract : The low‐ and high‐field electrical characterization of bottom‐up grown, metallic 1D WTe2 single crystals at the nanoscaleAbstract: As the elements of integrated circuits are downsized to the nanoscale, the current Cu‐based interconnects are facing limitations due to increased resistivity and decreased current‐carrying capacity because of scaling. Here, the bottom‐up synthesis of single‐crystalline WTe2 nanobelts and low‐ and high‐field electrical characterization of nanoscale interconnect test structures in various ambient conditions are reported. Unlike exfoliated flakes obtained by the top‐down approach, the bottom‐up growth mode of WTe2 nanobelts allows systemic characterization of the electrical properties of WTe2 single crystals as a function of channel dimensions. Using a 1D heat transport model and a power law, it is determined that the breakdown of WTe2 devices under vacuum and with AlO x capping layer follows an ideal pattern for Joule heating, far from edge scattering. High‐field electrical measurements and self‐heating modeling demonstrate that the WTe2 nanobelts have a breakdown current density approaching ≈100 MA cm −2, remarkably higher than those of conventional metals and other transition‐metal chalcogenides, and sustain the highest electrical power per channel length (≈16.4 W cm −1 ) among the interconnect candidates. The results suggest superior robustness of WTe2 against high‐bias sweep and its possible applicability in future nanoelectronics. Abstract : The low‐ and high‐field electrical characterization of bottom‐up grown, metallic 1D WTe2 single crystals at the nanoscale is investigated under various ambients. The WTe2 nanobelts have a breakdown current density approaching ≈100 MA cm −2, remarkably higher than those of conventional metals and other transition‐metal chalcogenides, and sustain the highest electrical power per channel length (≈16.4 W cm −1 ) among the interconnect candidates. … (more)
- Is Part Of:
- Advanced science. Volume 6:Issue 3(2019)
- Journal:
- Advanced science
- Issue:
- Volume 6:Issue 3(2019)
- Issue Display:
- Volume 6, Issue 3 (2019)
- Year:
- 2019
- Volume:
- 6
- Issue:
- 3
- Issue Sort Value:
- 2019-0006-0003-0000
- Page Start:
- n/a
- Page End:
- n/a
- Publication Date:
- 2018-12-12
- Subjects:
- bottom‐up process -- electrical performance and reliability -- future nanoelectronics -- nanoscale interconnect -- tungsten ditelluride (WTe2)
Science -- Periodicals
505 - Journal URLs:
- http://onlinelibrary.wiley.com/journal/10.1002/(ISSN)2198-3844 ↗
http://onlinelibrary.wiley.com/ ↗ - DOI:
- 10.1002/advs.201801370 ↗
- Languages:
- English
- ISSNs:
- 2198-3844
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - BLDSS-3PM
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- 12392.xml