Industrial application of atom probe tomography to semiconductor devices. (15th April 2018)

• Record Type: Journal Article
• Authors: Giddings, Alexander Devin; Koelling, Sebastian; Shimizu, Yasuo; Estivill, Robert; Inoue, Koji; Vandervorst, Wilfried; Yeoh, Wai Kong
• Is Part Of: Scripta materialia. Number 148(2018)
• Page Start: 82
• Page End: 90
• Publication Date: 2018-04-15
• Subjects: Atom probe tomography -- Semiconductor devices -- Failure analysis -- Dopant engineering -- 3D Metrology; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2017.09.004
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: Advanced semiconductor devices offer a metrology challenge due to their small feature size, diverse composition and intricate structure. Atom probe tomography (APT) is an emerging technique that provides 3D compositional analysis at the atomic-scale; as such, it seems uniquely suited to meet these challenges. However, the semiconductor industry has demanding requirements against which the techniques in use are evaluated. This article explores the use of APT in the semiconductor industry, showing the potential of the technique, the obstacles that occur in practise, and possible future developments. Graphical abstract: Image 1