High thermal conductivity property of polyamide-imide/boron nitride composite films by doping boron nitride quantum dots. Issue 44 (30th October 2019)

• Record Type: Journal Article
• Authors: Zhou, Shuaishuai; Xu, Tongle; Jiang, Fang; Song, Na; Shi, Liyi; Ding, Peng
• Is Part Of: Journal of materials chemistry. Volume 7:Issue 44(2019)
• Page Start: 13896
• Page End: 13903
• Publication Date: 2019-10-30
• Subjects: Materials -- Periodicals; Chemistry, Analytic -- Periodicals; Optical materials -- Research -- Periodicals; Electronics -- Materials -- Research -- Periodicals; 543.0284
• DOI: 10.1039/c9tc04381k
• Languages: English
• ISSNs: 2050-7526

Abstract

Abstract : In this study, we report a flexible polyamide-imide (PAI)/boron nitride nanosheet (BNNS) composite film with improved thermal conductivity by doping boron nitride quantum dots (BNQDs) using an evaporation-induced self-assembly method. Abstract : In this study, we report a flexible polyamide-imide (PAI)/boron nitride nanosheet (BNNS) composite film with improved thermal conductivity by doping boron nitride quantum dots (BNQDs) using an evaporation-induced self-assembly method. Continuous thermal conductive paths are constructed using BNQDs and BNNS in a PAI matrix, and the heat flow is effectively transmitted along the paths to improve the in-plane thermal conductivity (TC) of the PAI composite film. The synergistic effect between the BNNS and BNQDs plays a pivotal role in the formation of a continuous thermal conductive path. The PAI/BNNS/BNQD composite film shows an in-plane thermal conductivity of 7.69 W m −1 K −1 at a BNNS loading of 9 wt% and a BNQD loading of 1 wt%. This work provides valuable guidance for the design of thermal management materials to meet the efficient heat dissipation requirements of electronic devices.