Cite
HARVARD Citation
He, J. et al. (2018). Analytical model for adhesive die-attaching subjected to thermal loads using second-order beam theory. International journal of adhesion & adhesives. pp. 282-289. [Online].
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He, J. et al. (2018). Analytical model for adhesive die-attaching subjected to thermal loads using second-order beam theory. International journal of adhesion & adhesives. pp. 282-289. [Online].