Cyanate ester composites containing surface functionalized BN particles with grafted hyperpolyarylamide exhibiting desirable thermal conductivities and a low dielectric constant. Issue 62 (8th November 2019)

• Record Type: Journal Article
• Authors: Zhang, Xiuyun; Wang, Fan; Zhu, Yaping; Qi, Huimin
• Is Part Of: RSC advances. Volume 9:Issue 62(2019)
• Page Start: 36424
• Page End: 36433
• Publication Date: 2019-11-08
• Subjects: Chemistry -- Periodicals; 540.5
• DOI: 10.1039/c9ra06753a
• Languages: English
• ISSNs: 2046-2069

Abstract

Abstract : This graphic show the process of surface functionalization of BN and thermal conductivity of BN-HBP/CE composites with various ratios. Abstract : Surface functionalized BN particles with grafted hyperbranched polyarylamide (BN-HBP) were prepared and used to improve the thermal conductivity and low dielectric constant of BN-filled cyanate ester resin (BN-HBP/CE) composites. The thermal stability, dielectric properties, thermal conductivity and dynamic mechanical properties of the BN-HBP/CE composites were investigated. The results illustrate that BN-HBP/CE composites with a load of 32 wt% exhibit a high glass transition temperature of 283 °C, low dielectric constant of 3.29 at 1 MHz, and a desirable thermal conductivity of 0.97 W/(m·K). Additionally, these novel materials exhibit a high decomposition temperature of 5% weight loss at 407 °C and low curing shrinkage of −0.64%. When the loading is 38 wt%, the thermal conductivity of BN-HBP/CE composites is 1.27 W/(m·K). These findings have significant implications for the preparation of high-performance substrates that meet the requirements for application as printed circuit board substrates.