Cite
HARVARD Citation
Shi, Y. et al. (2019). Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics. Advanced functional materials. p. n/a. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Shi, Y. et al. (2019). Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics. Advanced functional materials. p. n/a. [Online].