Cite
HARVARD Citation
Sekhar, H. et al. (2020). The impact of silicon brick polishing on thin (120 μm) silicon wafer sawing yields and fracture strengths in diamond-wire sawing. Materials science in semiconductor processing. p. . [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Sekhar, H. et al. (2020). The impact of silicon brick polishing on thin (120 μm) silicon wafer sawing yields and fracture strengths in diamond-wire sawing. Materials science in semiconductor processing. p. . [Online].