A microstructured adhesive gripper with piezoelectric controlled adhesion, cleaning, and sensing. (22nd October 2019)

• Record Type: Journal Article
• Authors: Alizadehyazdi, Vahid; Spenko, Matthew
• Is Part Of: Smart materials and structures. Volume 28:Number 11(2019:Nov.)
• Publication Date: 2019-10-22
• Subjects: microstructures -- gecko-like adhesives -- cleaning -- tunable adhesion -- sensing -- piezoelectric -- gripper; Smart materials -- Periodicals; Strucural design -- Periodicals; 620.11
• DOI: 10.1088/1361-665X/ab46fc
• Languages: English
• ISSNs: 0964-1726

Abstract

Abstract: This paper builds upon prior work that used a piezoelectric element to remove dust from microstructured adhesives by also using that same piezoelectric element to tune adhesion (i.e. turn 'off' the adhesive) and act as a force/contact sensor. Results for ultrasonic detachment on three different substrates (carbon fiber/epoxy laminate, glass, and ceramic tile) show that there is a minimum required adhesion pressure such that the adhesive can successfully detach from a substrate, which is a function of overall adhesion strength. Experimental results for cleaning effectiveness demonstrate that the piezoelectric element can remove between 53% and 71% of ∅90– 106 μ m and ∅75– 90 μ m glass beads. Experiments also demonstrate 3%–11% recovery in adhesion on a flat glass substrate for a contaminated microstructured adhesive after contact with a dusty table. The performance of the adhesives is maintained after at least 1500 cycles. Finally, we show that the piezoelectric can also be used as a loadcell that can detect contact and measure preload.