Heat dissipation analysis of electronic equipment based on CFD. (August 2019)
- Record Type:
- Journal Article
- Title:
- Heat dissipation analysis of electronic equipment based on CFD. (August 2019)
- Main Title:
- Heat dissipation analysis of electronic equipment based on CFD
- Authors:
- Liu, Xianlong
Tang, Song
Feng, Mei - Abstract:
- Abstract: In order to quantitatively analyze the heat dissipation of high-power devices, Icepak software is used for analysis. Comparing the effects of fans on heat dissipation, two models were established respectively (with fan and without fan). Combining the advantages of Icepak, the grid around the radiator is combined with structured and unstructured grid. Through the analysis, the maximum temperature decreases by 22.2°C and 36.6% when there is a fan (the flow rate is 0.003kg/s).
- Is Part Of:
- Journal of physics. Volume 1300(2019)
- Journal:
- Journal of physics
- Issue:
- Volume 1300(2019)
- Issue Display:
- Volume 1300, Issue 1 (2019)
- Year:
- 2019
- Volume:
- 1300
- Issue:
- 1
- Issue Sort Value:
- 2019-1300-0001-0000
- Page Start:
- Page End:
- Publication Date:
- 2019-08
- Subjects:
- Physics -- Congresses
530.5 - Journal URLs:
- http://www.iop.org/EJ/journal/1742-6596 ↗
http://ioppublishing.org/ ↗ - DOI:
- 10.1088/1742-6596/1300/1/012112 ↗
- Languages:
- English
- ISSNs:
- 1742-6588
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5036.223000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 11970.xml