Hydrophilic low-temperature direct bonding of diamond and Si substrates under atmospheric conditions. (15th January 2020)

• Record Type: Journal Article
• Authors: Matsumae, Takashi; Kurashima, Yuichi; Umezawa, Hitoshi; Takagi, Hideki
• Is Part Of: Scripta materialia. Number 175(2020)
• Page Start: 24
• Page End: 28
• Publication Date: 2020-01-15
• Subjects: Diamond -- Hydrophilic bonding -- Low-temperature bonding -- Direct bonding under atmospheric conditions -- Damage-free diamond transfer; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2019.09.002
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: A monocrystalline diamond substrate was directly bonded with a Si substrate by annealing at low temperatures under atmospheric conditions. These substrate surfaces were functionalized with hydroxyl groups and subsequently bonded by a dehydration reaction. When a diamond (111) substrate was treated with a H2 SO4 /H2 O2 mixture, it generated a direct bonding with an oxygen-plasma-activated Si substrate without significant loss in diamond crystallinity. The proposed bonding technique would contribute to the diamond device fabrication because the high-crystallinity diamond layer can be transferred by the commonly used cleaning process followed by low-temperature annealing under atmospheric conditions. Graphical abstract: Unlabelled Image