Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements − Technology and Functional Test Results. Issue 19 (23rd April 2019)

• Record Type: Journal Article
• Authors: Meszmer, Peter; Hahn, Susann; Hiller, Karla; Wunderle, Bernhard
• Other Names: Zahn Dietrich R.T. guestEditor.; Schulz Stefan E. guestEditor.; Hiller Karla guestEditor.; Wagner Christian guestEditor.; Reuter Danny guestEditor.; Otto Thomas guestEditor.
• Is Part Of: Physica status solidi. Volume 216:Issue 19(2019)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2019-04-23
• Subjects: MEMS technology -- MEMS nano test stage -- piezoresistive force sensor -- reliability characterization -- thermal actuator; Solid state physics -- Periodicals; Solids -- Industrial applications -- Periodicals; 530.41
• DOI: 10.1002/pssa.201800936
• Languages: English
• ISSNs: 1862-6300

Abstract

Abstract : This paper reports on concepts, technology, integration aspects, and results of a MEMS‐based test platform for reliability tests of micro and nano objects. Building blocks of this platform to be used in in‐plane push‐pull‐configurations are a thermal actuator, a force sensor, and a displacement sensor as well as several types of samples to be integrated directly or indirectly. The technology concept is proven for aluminum wires as a first demonstrator for an integrated specimen. The modular concept enables the adoption of the platform for further types of samples and test configurations. The building blocks are simulated using a Finite‐Element approach and the results are compared to experimentally obtained data sets. According to the specifications, the thermal actuator is capable of providing displacements up to 1.5 μm. The displacement and the force sensor are specified to provide sensitivities of 3 fF nm −1 and 2.5 μV nN −1, respectively. SEM image of a piezoresistive force sensor attached to an integrated Al wire as test sample − building blocks of MEMS‐based test platforms. Abstract : This article reports on concepts, technology, integration aspects, and results of a MEMS‐based test platform for reliability tests of micro‐ and nano‐functional elements following a specimen centered approach. Building blocks of this platform to be used in in‐plane push‐pull‐configurations are a thermal actuator, a force sensor, and a displacement sensor as well as several types of samples to be integrated directly or indirectly.