Effect of package spacing on convective heat transfer from thermal sources mounted on a horizontal surface. (5th March 2018)
- Record Type:
- Journal Article
- Title:
- Effect of package spacing on convective heat transfer from thermal sources mounted on a horizontal surface. (5th March 2018)
- Main Title:
- Effect of package spacing on convective heat transfer from thermal sources mounted on a horizontal surface
- Authors:
- Ali, R.K.
Refaey, H.A.
Salem, M.R. - Abstract:
- Highlights: Three-dimensional analysis of an inline module composed of two thermal sources. Applicable range of air velocity ( 2464 ⩽ Re L ⩽ 16, 430 ), package spacing ratio ( 1 ⩽ s / L ⩽ 3 ). The gap effect on upstream thermal source temperature is vanished at s/L = 3. Increasing package spacing more than 3 has almost no additional enhancement on the downstream thermal source. Nusselt number correlations for the module were presented. Abstract: This work introduces a three-dimensional analysis of an inline module composed of two thermal sources using ANSYS-FLUENT Computational Fluid Dynamics (CFD) package. The effect of package spacing ratio (1 ≤ S ≤ 3) on the heat transfer coefficient of the upstream (UTS) and downstream (DTS) thermal sources within Reynolds number range of 2464 ⩽ Re L ⩽ 16, 430 are considered. The predictions are compared with the experiments performed on air wind tunnel with two thermal sources mounted on its horizontal surface within Reynolds number range of 4848 ⩽ Re L ⩽ 13, 635 . The numerical results are compared and validated with the experimental results and a good agreement is obtained. Compared to a single thermal source (STS), it is observed that the reduction in the average Nusselt number of the UTS and DTS is 26.3% and 35.6%, respectively, at S = 1. This reduction decreases to 4.9% and 12.6%, respectively, at S = 3. Finally, the present study aims to extend the printed circuit boards designers with average Nusselt number correlations forHighlights: Three-dimensional analysis of an inline module composed of two thermal sources. Applicable range of air velocity ( 2464 ⩽ Re L ⩽ 16, 430 ), package spacing ratio ( 1 ⩽ s / L ⩽ 3 ). The gap effect on upstream thermal source temperature is vanished at s/L = 3. Increasing package spacing more than 3 has almost no additional enhancement on the downstream thermal source. Nusselt number correlations for the module were presented. Abstract: This work introduces a three-dimensional analysis of an inline module composed of two thermal sources using ANSYS-FLUENT Computational Fluid Dynamics (CFD) package. The effect of package spacing ratio (1 ≤ S ≤ 3) on the heat transfer coefficient of the upstream (UTS) and downstream (DTS) thermal sources within Reynolds number range of 2464 ⩽ Re L ⩽ 16, 430 are considered. The predictions are compared with the experiments performed on air wind tunnel with two thermal sources mounted on its horizontal surface within Reynolds number range of 4848 ⩽ Re L ⩽ 13, 635 . The numerical results are compared and validated with the experimental results and a good agreement is obtained. Compared to a single thermal source (STS), it is observed that the reduction in the average Nusselt number of the UTS and DTS is 26.3% and 35.6%, respectively, at S = 1. This reduction decreases to 4.9% and 12.6%, respectively, at S = 3. Finally, the present study aims to extend the printed circuit boards designers with average Nusselt number correlations for the UTS and DTS as a function of Reynolds number and package spacing within 2464 ⩽ Re L ⩽ 16, 430 and (1 ≤ S ≤ 3). … (more)
- Is Part Of:
- Applied thermal engineering. Volume 132(2018)
- Journal:
- Applied thermal engineering
- Issue:
- Volume 132(2018)
- Issue Display:
- Volume 132, Issue 2018 (2018)
- Year:
- 2018
- Volume:
- 132
- Issue:
- 2018
- Issue Sort Value:
- 2018-0132-2018-0000
- Page Start:
- 676
- Page End:
- 685
- Publication Date:
- 2018-03-05
- Subjects:
- Electronic module -- Convective -- Numerical and experimental
Heat engineering -- Periodicals
Heating -- Equipment and supplies -- Periodicals
Periodicals
621.40205 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13594311 ↗
http://www.elsevier.com/homepage/elecserv.htt ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.applthermaleng.2018.01.006 ↗
- Languages:
- English
- ISSNs:
- 1359-4311
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 1580.101000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 11754.xml