An immersed jet array impingement cooling device with distributed returns for direct body liquid cooling of high power electronics. (5th November 2019)

• Record Type: Journal Article
• Authors: Wu, Ruikang; Fan, Yiwen; Hong, Tao; Zou, Hao; Hu, Run; Luo, Xiaobing
• Is Part Of: Applied thermal engineering. Volume 162(2019)
• Publication Date: 2019-11-05
• Subjects: Impingement jet -- Direct liquid cooling -- High power electronics -- TIM -- Immersed -- Body cooling; Heat engineering -- Periodicals; Heating -- Equipment and supplies -- Periodicals; Periodicals; 621.40205
• DOI: 10.1016/j.applthermaleng.2019.114259
• Languages: English
• ISSNs: 1359-4311

Abstract

Highlights: A jet array impingement device for direct body liquid cooling is proposed. A high power test facility for up to 800 W heat power is established. The low temperature rise of 38.7 °C is achieved with heat power of 800 W. The maximum effective heat transfer coefficient h = 41, 377 W/m 2 ·K is achieved. The combine effect of body cooling and 3D thermal conduction is studied. Abstract: Heat removal of high-power electronic devices has become the bottleneck that restricts the working performances. For ultrahigh heat flux density, even a thin layer of thermal interface material will dominate the temperature rise along the whole heat dissipation path. The existing liquid cooling only consider the cooling of the top surface of the electronic devices/chips, causing insufficient utilization of the cooling potential. In this paper, an immersed jet array impingement cooling device with distributed returns was designed, fabricated, and tested. In the proposed cooling device, the chip is immersed in the coolant and the coolant is ejected onto all the immersed surface of the electronics through the impinging jets, enabling to provide body cooling for high-power electronics. To prevent the jet interference between adjacent jets, distributed extraction returns were set between the adjacent jets for coolant to exit the impingement domain without flowing past the surrounding jets. The measured average temperature of the high-power chip with input heat power 550 W and flow rate 1000 ml/min is 77.0 °C, where the effective heat flux is 110 W/cm 2, and the inlet coolant temperature is maintained to be 40 °C. The average temperature of the high-power chip under the input heat power of 800 W (160 W/cm 2 ) is 78.7 °C with the flow rate reaching 2000 ml/min. The effective heat transfer coefficient of 41, 377 W/m 2 ·K in maximum was achieved. The present body cooling is expected to provide high heat removal ability and be used for ultrahigh heat flux density electronics.