Thermal Conductive Composites: Anisotropic Thermal Conductive Composite by the Guided Assembly of Boron Nitride Nanosheets for Flexible and Stretchable Electronics (Adv. Funct. Mater. 37/2019). (10th September 2019)

• Record Type: Journal Article
• Authors: Hong, Haeleen; Jung, Yei Hwan; Lee, Ju Seung; Jeong, Chanho; Kim, Jong Uk; Lee, Sori; Ryu, Hyewon; Kim, Heyn; Ma, Zhenqiang; Kim, Tae‐il
• Is Part Of: Advanced functional materials. Volume 29:Number 37(2019)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2019-09-10
• Subjects: anisotropic thermal conduction -- boron nitride nanocomposite -- flexible and stretchable heat sink -- networked assembly -- tetrahedral structures; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adfm.201970252
• Languages: English
• ISSNs: 1616-301X

Abstract

Abstract : In article number1902575, Tae‐il Kim and co‐workers present a flexible/stretchable heat sink embedded with boron nitride nanosheets along with tetrahedral interlayer structures. The structured boron nitride layer in the composites induces high thermal conductivity in through‐ as well as in‐plane directions even with a low boron nitride fraction. It is potentially useful in deformable electronics.