A new domain-independent interaction integral for an interface crack subjected to thermal loading. (January 2020)

• Record Type: Journal Article
• Authors: Guo, Licheng; Jia, Pengfei; Yu, Hongjun; Kitamura, Takayuki; Huang, Kai
• Is Part Of: International journal of solids and structures. Volume 182/183(2020)
• Page Start: 254
• Page End: 266
• Publication Date: 2020-01
• Subjects: Domain-independent interaction integral (DII-integral) -- Stress intensity factors (SIFs) -- Thermal mismatch interfaces -- Interface crack -- Extended finite element method -- Interface; Mechanics, Applied -- Periodicals; Structural analysis (Engineering) -- Periodicals; Elastic solids -- Periodicals; Mécanique appliquée -- Périodiques; Constructions, Théorie des -- Périodiques; Solides élastiques -- Périodiques; Elastic solids; Mechanics, Applied; Structural analysis (Engineering); Periodicals; 624.18
• DOI: 10.1016/j.ijsolstr.2019.07.023
• Languages: English
• ISSNs: 0020-7683

Abstract

Abstract: A new interaction integral (I-integral) is established to extract the stress intensity factors (SIFs) of an interface crack in the materials with complex interfaces subjected to thermal loading. For the interface crack problems, I-integral is found to be domain-dependent for thermal mismatch interfaces in thermal fracture analysis, which leads to great difficulty in obtaining the SIFs. In order to eliminate the effects of interfaces on the I-integral, this study proposes a new auxiliary field and establishes the corresponding domain-independent I-integral (DII-integral) for thermal mismatch interfaces. To ensure the numerical accuracy, the conventional I-integral must calculate the line integrals along the thermal mismatch interfaces, which brings great trouble for the materials with complex interfaces contained in the integral domain. Through introducing a new auxiliary field, the present DII-integral can avoid additional computation brought by thermal mismatch interfaces, which significantly facilitates the thermal fracture analysis of the materials with complex interfaces. The I-integral combined with the extended finite element method (XFEM) is applied to investigate several representative examples to verify the accuracy and domain-independence of the I-integral. The results indicate that the new DII-integral is reliable and domain-independent for arbitrary interfaces.