Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study. (December 2019)

• Record Type: Journal Article
• Authors: Liu, Yu-chen; Yu, Yung-si; Lin, Shih-kang; Chiu, Shang-Jui
• Is Part Of: Scripta materialia. Number 173(2019)
• Page Start: 134
• Page End: 138
• Publication Date: 2019-12
• Subjects: Electromigration -- Alloys -- Synchrotron radiation-based XRD -- Phase stability; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2019.08.008
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: Electromigration (EM) is a major failure mode in electronic interconnections, which is commonly made of Ag, Cu, and their alloys. Herein, a single- and two-phase AgCu alloys were subjected with current density of 4 × 10 5 A/cm 2 for in situ microstructural and crystallographic characterizations. Anomalous grain growth and the formation of cord-like grains with an aspect ratio over 1000 and asymmetrical hillock/voids clusters were found. These abnormal morphological evolutions were resulted from the electron flow-induced lattice strains, which was inversely correlated with the lifespan of interconnection. Multi-phase alloys are less resistant to EM due to the unbalanced electron flow-induced strains. Graphical abstract: Unlabelled Image